Module Development Engineer

Job Description

Key Responsibilities

• Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology
• system design. - Drive technology development and enablement for both high-volume manufacturing and future technologies. - Perform feasibility studies using simulations and engineering methodologies to meet desired device specifications. - Conduct pathfinding activities to develop innovative process solutions for next-generation device architectures. - Develop and implement technology roadmaps to guide future manufacturing needs. - Collaborate with equipment and material suppliers to design and implement enabling process technologies. - Optimize production efficiency, manufacturing techniques
• output for existing and new products. - Utilize statistical process control and data analytics to enhance process stability and drive continuous improvements. - Recommend and execute modifications to operational equipment to boost efficiency and manufacturing scalability. - Partner with cross-functional teams to ensure alignment on process integration and project deliverables.
• The candidate should demonstrate the following behavioral traits. - Strong problem-solving skills and ability to address complex technical challenges. - Proven track record of collaboration with cross-functional teams, including yield, operations, and supplier management

Qualifications

• Minimum qualifications are required to be initially considered for this position.
• Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
• Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research

Minimum Qualifications

• PhD degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics
• a related STEM discipline with 1+ years of relevant experience. - OR Master's degree in the same fields with 4+ years of experience.
• Experience listed above should be a combination in the following: - Manufacturing process development experience, statistical process control, process improvement
• data analytics. -Hands on experience in wafer-level assembly, semiconductor processing
• advanced packaging technology development

Preferred Qualifications

• Experience in wafer-level assembly, epoxy, mold materials, annealing or related fields in advanced packaging. - Demonstrated expertise in leading programs from strategy formation to high-volume production. - Familiarity with advanced packaging technologies such as hybrid bonded interconnects, RDL-based packaging
• ultra-fine pitch solder connections. - Experience in design rule development for Manufacturability/ REL Join Intel's team and help shape the future of semiconductor technology through innovation and excellence.
• Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly.
• We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.
• Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures
• assembly/test packages the compute devices to improve the lives of every person on Earth.
• Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation
• any other characteristic protected by local law, regulation
• Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry.
• It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel .
• Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
• Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
• Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
• Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices.
• We do not charge any fees during our hiring process.
• Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.
• If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.